Semiconductor device having sealing film formed on the surface having columnar electrode formed thereon and method of manufacturing the same
AssigneeCasio Computer Co., Ltd.
InventorOsamu Kuwabara
Life of this patent
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Abstract
A sealing film is formed by a screen printing method. In this case, the temperature of the printing table is set at about 30 to 50° C. by the heat generation from a planar heater arranged within the printing table. A liquid sealing resin having a relatively high viscosity of about 500,000 to 1,500,000 cPS is used for forming the sealing film. However, the liquid sealing film is warmed by the printing table to about 30 to 50° C. As a result, the viscosity of the liquid sealing resin is lowered to about 50,000 to 200,000 cPS. After the curing, the viscosity of the sealing film is brought back to the original value of about 500,000 to 1,500,000 cPS.
Claims31
A method of manufacturing a semiconductor device, comprising the steps of:
- preparing a semiconductor substrate having a plurality of columnar electrodes formed apart from each other on one main surface;
- loading a warmed liquid sealing resin between adjacent columnar electrodes on at least one main surface of the semiconductor substrate;
- and
- cooling the liquid sealing resin so as to solidify the sealing resin to form a sealing film on said one main surface of the semiconductor substrate.
A method of manufacturing a semiconductor device, comprising the steps of:
- preparing a semiconductor substrate having a plurality of columnar electrodes formed apart from each other on one main surface;
- arranging a printing mask on said semiconductor substrate;
- heating the semiconductor substrate and said printing mask to a predetermined temperature;
- supplying a liquid sealing resin onto the printing mask so as to have the liquid sealing resin warmed by the printing mask;
- and
- loading the warmed liquid sealing resin into the clearance between adjacent columnar electrodes formed on one main surface of the semiconductor substrate so as to form a sealing film.
A method of manufacturing a semiconductor device, comprising the steps of:
- preparing a semiconductor substrate having a plurality of columnar electrodes formed apart from each other on one main surface;
- arranging a mask on one main surface of the semiconductor substrate;
- printing a liquid sealing resin on said one main surface of the semiconductor substrate from above the mask by using a squeegee so as to form a sealing film loaded in the clearance between adjacent columnar electrodes;
- and
- measuring the weight of the semiconductor substrate having the sealing film formed thereon so as to judge whether or not the thickness of the sealing film is appropriate.
Dependencies are inferred from the claim text.