US 6,471,913 B1Granted

Method and apparatus for processing a microelectronic workpiece including an apparatus and method for executing a processing step at an elevated temperature

AssigneeSemitool, Inc.

InventorsRobert A. Weaver, Paul R. McHugh, Gregory J. Wilson

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Abstract

An apparatus for thermally processing a microelectronic workpiece is set forth. The apparatus comprises a first assembly and a second assembly, disposed opposite one another, with an actuator disposed to provide relative movement between the first assembly and second assembly. More particularly, the actuator provides relative movement between at least a loading position in which the first assembly is in a state for loading or unloading of the microelectronic workpiece, and a thermal processing position in which the first assembly and second assembly are proximate one another and form a thermal processing chamber. A thermal transfer unit is disposed in the second assembly and has a workpiece support surface that is heated and cooled in a controlled manner. As the first assembly and second assembly are driven to the thermal processing position by the actuator, an arrangement of elements bring a surface of the microelectronic workpiece into direct physical contact with the workpiece support surface of the thermal transfer unit. In a preferred embodiment, the thermal transfer unit is comprised of a low thermal mass heater and a high thermal mass cooler disposed to controllably cool the low thermal mass heater.

Claims22

Dependent claims

An apparatus for thermally processing a microelectronic workpiece, the apparatus comprising:

a first assembly;
a second assembly disposed opposite the first assembly;
one or more elements arranged to support the microelectronic workpiece on the either the first or second assemblies, the one or more elements further being arranged to facilitate automatic loading and unloading of the microelectronic workpiece;
an actuator disposed to provide relative movement between the first assembly and second assembly between at least a loading position in which the first assembly and the second assembly are in a state for loading or unloading of the microelectronic workpiece, and a thermal processing position in which the first assembly and second assembly are proximate one another and form a thermal processing chamber;
a thermal transfer unit disposed in the second assembly, the thermal transfer unit having a workpiece support surface that is heated and cooled in a controlled manner, the one or more elements of the second assembly bringing a surface of the microelectronic workpiece into direct physical contact with the workpiece support surface of the thermal transfer unit as the first assembly and second assembly are driven to the thermal processing position by the actuator, the thermal transfer unit further comprising:
a thick film heater assembly having a first surface forming the wafer support surface of the thick film heater, and a second surface opposite the first surface;
and
a cooling chuck having a surface proximate the second surface of the thick film heater.

5 more elements

An apparatus for thermally processing a microelectronic workpiece, the apparatus comprising:

a first assembly;
a second assembly disposed opposite the first assembly;
one or more elements arranged to support the microelectronic workpiece on the either the first or second assemblies, the one or more elements further being arranged to facilitate automatic loading and unloading of the microelectronic workpiece;
an actuator disposed to provide relative movement between the first assembly and second assembly between at least a loading position in which the first assembly and the second assembly are in a state for loading or unloading of the microelectronic workpiece, and a thermal processing position in which the first assembly and second assembly are proximate one another and form a thermal processing chamber;
a thermal transfer unit disposed in the second assembly, the thermal transfer unit having a workpiece support surface that is heated and cooled in a controlled manner, the one or more elements of the second assembly bringing a surface of the microelectronic workpiece into direct physical contact with the workpiece support surface of the thermal transfer unit as the first assembly and second assembly are driven to the thermal processing position by the actuator, the thermal transfer unit further comprising:
a low thermal mass heater;
and
a high thermal mass cooler disposed to controllably cool the low thermal mass heater.

5 more elements

Dependencies are inferred from the claim text.