Method of forming metal contact pads on a metal support substrate
AssigneeSarnoff Corporation
InventorsBarry Jay Thaler, Ashok Narayan Prabhu
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Abstract
A method of forming low resistance contact pads on a metal support substrate for a multilayer ceramic printed circuit board comprising forming a patterned layer of a conductive metal on the metal support substrate made of the same metal as that used to form the circuitry on the ceramic circuit board, and firing the support substrate. The patterned conductive metal can be formed by electroplating, by screen printing from a fritless conductor ink or by screen printing from a glass frit-containing conductor ink that includes a reducing agent.
Claims11
A method of forming low resistance metal contact pads on a metal support substrate for a multilayer ceramic precursor green tape stack, said green tape comprising glass particles and an organic vehicle having circuitry printed thereon comprising
- forming a patterned layer of conductive metal on the unfired metal support substrate, said conductive metal made of the same metal as circuitry present on the green tape stack, and
- firing the patterned support.
Dependencies are inferred from the claim text.