Selection of evaluation point locations based on proximity effects model amplitudes for correcting proximity effects in a fabrication layout

A method of correcting for proximity effects associated with an edge in a layout corresponding to a design layer, the method comprising:

• determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge;
• determining an evaluation point based on at least one of the profile and the dissection points;
• and
• determining how to correct a segment of the edge corresponding to two dissection points for proximity effects based on an analysis at the evaluation point.

A method of correcting for proximity effects associated with a first edge in a first layout corresponding to a design layer for a printed features layer, the method comprising:

• deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout;
• and
• determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter;
• and
• determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

A method of using a computer to correct for proximity effects associated with a first edge in a first layout corresponding to a design layer, the computer having a processor coupled to a computer-readable medium, the computer-readable medium storing at least a portion of the design layer, the design layer corresponding to a portion of an integrated circuit, the method comprising:

• deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout;
• and
• determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter;
• and
• determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

A method of correcting for proximity effects associated with a first edge in a first layout corresponding to a design layer for a printed features layer, the method comprising:

• deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout;
• and
• determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter;
• and
• determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

A method of using a computer to correct for proximity effects associated with a first edge in a first layout corresponding to a design layer, the computer having a processor coupled to a computer-readable medium, the computer-readable medium storing at least a portion of the design layer, the design layer corresponding to a portion of an integrated circuit, the method comprising:

• deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout;
• and
• determining an evaluation point on the first edge in the first layout corresponding to the design layer based on the dissection length parameter;
• and
• determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

A computer readable medium for correcting proximity effects associated with an edge in a layout corresponding to a design layer, the computer readable medium carrying instructions to cause one or more processors to perform:

• determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge;
• determining an evaluation point based on at least one of the profile and the dissection points;
• and
• determining how to correct a segment of the edge corresponding to two dissection points for proximity effects based on an analysis at the evaluation point.

A computer readable medium for correcting proximity effects associated with a first edge in a first layout corresponding to a design layer for a printed features layer, the computer readable medium carrying instructions to cause one or more processors to perform:

• deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout;
• and
• determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter;
• and
• determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

A computer readable medium for correcting proximity effects associated with a first edge in a first layout corresponding to a design layer for a printed features layer, the computer readable medium carrying instructions to cause one or more processors to perform:

• deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout;
• and
• determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter;
• and
• determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

A carrier wave for correcting proximity effects associated with an edge in a layout corresponding to a design layer, the carrier wave carrying instructions to cause one or more processors to perform:

• determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge;
• determining an evaluation point based on at least one of the profile and the dissection points;
• and
• determining how to correct a segment of the edge corresponding to two dissection points for proximity effects based on an analysis at the evaluation point.

A carrier wave for correcting proximity effects associated with a first edge in a first layout corresponding to a design layer for a printed features layer, the carrier wave carrying instructions to cause one or more processors to perform:

• deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout;
• and
• determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter;
• and
• determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

A carrier wave for correcting proximity effects associated with a first edge in a first layout corresponding to a design layer for a printed features layer, the carrier wave carrying instructions to cause one or more processors to perform:

• deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout;
• and
• determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter;
• and
• determining how to correct at least a portion of the first edge for proximity effects based on an analysis at the evaluation point.

A computer system for correcting proximity effects associated with an edge in a layout corresponding to a design layout, the computer system comprising:

• a computer readable medium carrying data representing the edge and at least a portion of the design layout, the design layout corresponding to a portion of an integrated circuit;
• and
• one or more processors coupled to the computer readable medium, the one or more processors configured for
• determining an evaluation point for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge,
• determining a correction based on an analysis of an amplitude from the profile at the evaluation point, and
• applying the correction to at least a portion of the edge.

A computer system for correcting proximity effects associated with an edge in a layout corresponding to a design layout, the computer system comprising:

• a computer readable medium carrying data representing the edge and at least a portion of the design layout, the design layout corresponding to a portion of an integrated circuit;
• and
• one or more processors coupled to the computer readable medium, the one or more processors configured for
• determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge,
• determining an evaluation point based on at least one of the profile and the dissection points,
• determining a correction based on an analysis of an amplitude from the profile at the evaluation point, and
• applying the correction to at least a portion of the edge corresponding to two dissection points.

A computer system for correcting proximity effects associated with a first edge in a first layout corresponding to a design layout, the computer system comprising:

• a computer readable medium carrying data representing the edge and at least a portion of the design layout, the design layout corresponding to a portion of an integrated circuit;
• and
• one or more processors coupled to the computer readable medium, the one or more processors configured for
• deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout,
• determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter,
• executing a routine implementing the proximity effects model for the evaluation point to produce a model amplitude at the evaluation point,
• determining a correction based on an analysis of the model amplitude at the evaluation point, and
• applying the correction to at least a portion of the edge.

A computer system for correcting proximity effects associated with a first edge in a first layout corresponding to a design layout, the computer system comprising:

• a computer readable medium carrying data representing the edge and at least a portion of the design layout, the design layout corresponding to a portion of an integrated circuit;
• and
• one or more processors coupled to the computer readable medium, the one or more processors configured for
• deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout,
• determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter,
• executing a routine implementing the proximity effects model for the evaluation point to produce a model amplitude at the evaluation point
• determining a correction based on an analysis of the model amplitude at the evaluation point, and
• applying the correction to at least a portion of the edge.

A system for correcting proximity effects associated with an edge in a layout corresponding to a design layout, the system comprising:

• a means for determining an evaluation point for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge,
• the proximity effects model for producing the profile;
• a means for analyzing an amplitude from the profile at the evaluation point to determine a correction;
• and
• a means for applying the correction to at least a portion of the edge.

A system for correcting proximity effects associated with an edge in a layout corresponding to a design layout, the system comprising:

• a means for determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge and determining an evaluation point based on at least one of the profile and the dissection points,
• the proximity effects model for producing the profile;
• a means for analyzing an amplitude from the profile at the evaluation point to determine a correction;
• and
• a means for applying the correction to at least a portion of the edge corresponding to two dissection points.

A system for correcting proximity effects associated with a first edge in a first layout corresponding to a design layout, the system comprising:

• a means for deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout,
• a means for determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter,
• the proximity effects model for producing a model amplitude at the evaluation point;
• a means for analyzing the model amplitude at the evaluation point to determine a correction;
• and
• a means for applying the correction to at least a portion of the first edge.

A system for correcting proximity effects associated with a first edge in a first layout corresponding to a design layout, the system comprising:

• a means for deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout,
• a means for determining an evaluation point for the first edge in the first layout corresponding to the design layer based on the dissection length parameter,
• the proximity effects model for producing a model amplitude at the evaluation point;
• a means for analyzing the model amplitude at the evaluation point to determine a correction;
• and
• a means for applying the correction to at least a portion of the first edge.

A method for fabricating a printed features layer including features corrected for proximity effects, the method comprising:

• building an initial fabrication layout based on a design layer corresponding to the printed features layer, the fabrication layout including a edge of a polygon;
• determining an evaluation point for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge,
• analyzing an amplitude from the profile at the evaluation point to determine a correction;
• applying the correction to at least a portion of the edge;
• producing a mask based on the portion of the edge corrected;
• and
• producing the printed features layer in a fabrication process using the mask.

A method for fabricating a printed features layer including features corrected for proximity effects, the method comprising:

• building an initial fabrication layout based on a design layer corresponding to the printed features layer, the fabrication layout including a edge of a polygon;
• determining dissection points for the edge based on a profile of amplitudes output from a proximity effects model along a transect including a target edge in the design layer corresponding to the edge;
• determining an evaluation point based on at least one of the profile and the dissection points;
• analyzing an amplitude from the profile at the evaluation point to determine a correction;
• applying the correction to at least a portion of the edge;
• producing a mask based on the portion of the edge corrected;
• and
• producing the printed features layer in a fabrication process using the mask.

A method for fabricating a printed features layer including features corrected for proximity effects, the method comprising:

• building an initial fabrication layout based on a design layer corresponding to the printed features layer, the fabrication layout including a first edge of a first polygon;
• deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect including a second edge in a second layout;
• determining an evaluation point for the first edge in the initial fabrication layout based on the dissection length parameter;
• executing a routine implementing a proximity effects model for producing a model amplitude at the evaluation point;
• analyzing the model amplitude to determine a correction;
• applying the correction to at least a portion of the edge;
• producing a mask based on the portion of the edge corrected;
• and
• producing the printed features layer in a fabrication process using the mask.

A method for fabricating a printed features layer including features corrected for proximity effects, the method comprising:

• building an initial fabrication layout based on a design layer corresponding to the printed features layer, the fabrication layout including a first edge of a first polygon;
• deriving a dissection length parameter based on a profile of amplitudes output by a proximity effects model along a transect crossing a plurality of polygons in a second layout;
• determining an evaluation point for the first edge in the initial fabrication layout based on the dissection length parameter;
• executing a routine implementing a proximity effects model for producing a model amplitude at the evaluation point;
• analyzing the model amplitude to determine a correction;
• applying the correction to at least a portion of the edge;
• producing a mask based on the portion of the edge corrected;
• and
• producing the printed features layer in a fabrication process using the mask.