Exposure apparatus, semiconductor manufacturing apparatus, and semiconductor manufacturing method

An exposure apparatus for performing exposure processing for a plurality of substrates using original plates, including a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, said apparatus comprising:

• switching means for switching from the first original plate to the second original plate during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed by using the first original plate, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

An exposure apparatus for performing exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, using original plates, which include a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, said apparatus comprising:

• job switching means for switching from the first job to the second job during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed;
• and
• original plate switching means for switching from the first original plate to the second original plate during or after a period of exposure of a final shot of the final substrate to be exposed, by using the first original plate, and before the exposed final substrate is unloaded from the position at which the final substrate is exposed.

A semiconductor manufacturing method of controlling an exposure mechanism using a controller to perform exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, and manufacturing semiconductor devices from the exposed substrates, said method comprising the step of:

• switching, by the controller, from the first job to the second job during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

A semiconductor manufacturing method of controlling an exposure mechanism using a controller to perform exposure processing for a plurality of substrates using original plates, which include a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, and manufacturing semiconductor devices from the exposed substrates, said method comprising the step of:

• switching, by the controller, from the first original to the second original plate during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed by using the first original plate, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

A semiconductor manufacturing method of controlling an exposure mechanism using a controller to perform exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, using original plates, which include a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, and manufacturing semiconductor devices from the exposed substrates, said method comprising the step of:

• switching, by the controller, from the first job to the second job and switching from the first original plate to the second original plate during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job by using the original plate, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

A computer-readable storage medium which stores a control program of an exposure apparatus for performing exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, wherein the storage medium is executed in the exposure apparatus to operate as switching means for switching from the first job to the second job during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

A computer-readable storage medium which stores a control program of an exposure apparatus for performing exposure processing for a plurality of substrates using a plurality of original plates, including a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, wherein the storage medium is executed in the exposure apparatus to operate as switching means for switching from the first original plate to the second original plage during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed by using the first original plate, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

A computer-readable storage medium which stores a control program of an exposure apparatus for performing exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, using original plates, which include a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, wherein the storage medium is executed in the exposure apparatus to operate as:

• job switching means for switching from the first job to the second job during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed, and
• original plate switching means for switching from the first original plate to the second original plate during or after a period of exposure of a final shot of the final substrate to be exposed, by using the first original plate, and before the exposed final substrate is unloaded from the position at which the final substrate is exposed.