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US 6,445,194 B1Granted
Structure and method for electrical method of determining film conformality
AssigneeInternational Business Machines Corporation
InventorsJames W. Adkisson, Arne W. Ballantine, Ralph W. Young
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Abstract
The invention provides a monitor wafer and a method using the wafer to measure the conformality of dielectric films and in particular, for measuring the sidewall deposition thickness of dielectric films.
Claims50
A conformality monitoring kit comprising:
- a high surface area ratio capacitor;
- a low surface area ratio capacitor;
- means for monitoring capacitance, electrically coupled to said capacitors;
- and
- means for converting capacitance into conformality, logically coupled to said monitoring means.
2 more elements
A method of measuring the conformality of a film comprising:
- providing a first capacitor having a high surface area ratio;
- providing a second capacitor having a low surface area ratio;
- providing means of monitoring capacitance of said first and said second capacitors wherein said monitoring means are electrically connected to said first and said second capacitors;
- providing an algorithm for converting said capacitance into conformality wherein said algorithm is logically coupled to said monitoring means;
- and
- converting capacitance into conformality using said algorithm.
3 more elements
Dependencies are inferred from the claim text.