Splitting and assigning power planes

Abstract

A method for assigning signal traces to one of a plurality of power planes on a power layer of an integrated circuit package. The integrated circuit package has an integrated circuit signal contact region, a top routing layer, and a bottom routing layer. The power layer underlies both the top routing layer and the bottom routing layer. First signal traces on the bottom routing layer are routed from contacts disposed in a core portion of the integrated circuit signal contact region to first ball contacts disposed within a first perimeter of the integrated circuit package. The first perimeter has dimension corresponding to a first distance from the integrated circuit signal contact region. Second signal traces on the top routing layer are routed from contacts disposed in a peripheral portion of the integrated circuit signal contact region to second ball contacts. The second ball contacts are disposed outside of the first perimeter of the integrated circuit package and within a second perimeter of the integrated circuit package. The second perimeter has dimensions corresponding to a second distance from the integrated circuit signal contact region, where the second distance is greater than the first distance. The power layer is segmented into the plurality of power planes. At least a first power plane of the plurality of power planes is bounded within the first perimeter. The first power plane is configured to carry a first voltage corresponding to the first signal traces. The first ball contacts are in proximity to the first power plane. At least a second power plane of the plurality of power planes is bounded between the first perimeter and the second perimeter. The second power plan is configured to carry a second voltage corresponding to the second signal traces. The second ball contacts are in proximity to the second power plane.

Dependencies are inferred from the claim text.