Method of forming a damascene structure using a sacrificial conductive layer
AssigneeInternational Business Machines Corporation
InventorsPeter E. Biolsi, Gregory S. Jankowski, Laurie M. Krywanczyk, Anthony K. Stamper
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Abstract
A method of forming a damascene structure using a sacrificial conductive layer to provide a uniform focus plane for the photolithography tool during formation of circuit features. In particular, a metal layer is provided between the insulative layer and the photoresist, upon which the capacitive sensors of the photolithography tool focus during the formation of the circuit features, namely, troughs and vias.
Claims24
A method of forming a damascene structure, comprising the steps of:
- providing a substrate having an insulative layer;
- depositing a sacrificial conducive layer on the insulative layer using a physical vapor deposition technique;
- and
- forming at least one circuit feature within the insulative layer.
A method of forming a damascene structure, comprising the steps of:
- providing a substrate having an insulative layer;
- depositing a sacrificial conductive layer on the insulative layer;
- and
- forming at least one circuit feature within the insulative layer;
- wherein the method of forming the at least one circuit feature further comprises the steps of:
- (a) depositing a layer of photoresist;
- (b) patterning the layer of photoresist;
- (c) etching the sacrificial conductive layer and the insulative layer;
- and
- (d) removing the layer of photoresist.
A method of forming damascene lines within an insulated substrate, comprising the steps of:
- depositing a sacrificial conductive layer on the insulated substrate;
- and
- forming at least one circuit feature within the insulated substrate, using a patterning tool, wherein the sacrificial conductive layer provides a uniform focus plane for the patterning tool.
Dependencies are inferred from the claim text.