Method and apparatus for controlling a plating process
AssigneeAdvanced Micro Devices, Inc.
InventorsAlexander J. Pasadyn, Thomas J. Sonderman
Life of this patent
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Abstract
A method for controlling a plating process includes plating a process layer on a wafer in accordance with a recipe; measuring a thickness of the process layer; and determining at least one plating parameter of the recipe for subsequently formed process layers based on the measured thickness. A processing line includes a plating tool, a metrology tool, and a process controller. The plating tool is adapted to form a process layer on a wafer in accordance with a recipe. The metrology tool is adapted to measure a thickness of the process layer. The process controller is adapted to determine at least one plating parameter of the recipe for subsequently formed process layers based on the measured thickness.
Claims27
A method for controlling a plating process, comprising:
- plating a process layer on a wafer in accordance with a recipe;
- measuring a thickness of the process layer;
- and
- determining at least one plating parameter of the recipe for subsequently formed process layers based on the measured thickness.
A method for controlling a plating process, comprising:
- plating a process layer on a wafer in accordance with a recipe;
- measuring a thickness of the process layer;
- and
- determining an electrolyte temperature parameter of the recipe for subsequently formed process layers based on the measured thickness.
A method for controlling a plating process, comprising:
- plating a process layer on a wafer in accordance with a recipe;
- measuring a thickness of the process layer;
- and
- determining a potential parameter of the recipe for subsequently formed process layers based on the measured thickness.
A processing line, comprising:
- a plating tool adapted to form a process layer on a wafer in accordance with a recipe;
- a metrology tool adapted to measure a thickness of the process layer;
- and
- a process controller adapted to determine at least one plating parameter of the recipe for subsequently formed process layers based on the measured thickness.
A processing line, comprising:
- a plating tool adapted to form a process layer on a wafer in accordance with a recipe;
- a metrology tool adapted to measure a thickness of the process layer;
- and
- a process controller adapted to determine an electrolyte temperature parameter of the recipe for subsequently formed process layers based on the measured thickness.
A processing line, comprising:
- a plating tool adapted to form a process layer on a wafer in accordance with a recipe;
- a metrology tool adapted to measure a thickness of the process layer;
- and
- a process controller adapted to determine a potential parameter of the recipe for subsequently formed process layers based on the measured thickness.
A processing line, comprising:
- means for plating a process layer on a wafer in accordance with a recipe;
- means for measuring a thickness of the process layer;
- and
- means for determining at least one plating parameter of the recipe for subsequently formed process layers based on the measured thickness.
Dependencies are inferred from the claim text.