US 6,444,394 B1Granted

Positive-working photoresist composition

AssigneeTokyo Ohka Kogyo Co., Ltd.

InventorsKazufumi Sato, Satoshi Maemori, Taku Nakao, Kazuyuki Nitta

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Abstract

Disclosed is a novel chemical-amplification positive-working photoresist composition capable of giving a patterned resist layer with excellent properties such as photosensitivity, pattern resolution, heat resistance and cross sectional profile of the patterned resist layer. The composition is characterized by the use of, as the film-forming resinous component, a hydroxyl-containing resinous ingredient which a combination of a first resin of which from 30 to 60% the hydroxyl groups are substituted by acid-dissociable solubility-reducing groups and a second resin of which from 5 to 20% of the hydroxyl groups are substituted by acid-dissociable groups of the same kind as in the first resin a weight proportion of 1.9 to 9:1.

Claims4

Dependent claims

A chemical-amplification positive-working photoresist composition which comprises, as a uniform solution in an organic solvent:

(A) a polyhydroxystyrene-based resinous ingredient of which the hydroxyl groups are partly substituted by acid-dissociable substituent groups capable of being dissociated by interacting with an acid;
and
(B) a radiation-sensitive acid-generating compound capable of releasing an acid by irradiation with a radiation,
the resinous ingredient as the component (A) being a combination comprising (A1) a first polyhydroxystyrene resin substituted at from 30 to 60% of the hydroxyl groups by tetrahydropyranyl groups and (A2) a second polyhydroxy-styrene resin substituted at from 5 to 20% of the hydroxyl groups by tetrahydropyranyl groups which are the same as in the first polyhydroxystyrene resin (A1), with the proviso that the ratio of the maximum weight-average molecular weight Mwmax to the minimum weight-average molecular weight Mwmin in the first and second polyhydroxystyrene resins (A1) and (A2) is smaller than 1.5.

1 more element

A chemical-amplification positive-working photoresist composition which comprises, as a uniform solution in an organic solvent:

(A) a polyhydroxystyrene-based resinous ingredient of which the hydroxyl groups are partly substituted by acid-dissociable substituent groups capable of being dissociated by interacting with an acid;
and
(B) a radiation-sensitive acid-generating compound capable of releasing an acid by irradiation with a radiation,
the resinous ingredient as the component (A) being a combination comprising (A1) a first polyhydroxystyrene resin substituted at from 30 to 60% of the hydroxyl groups by 1-ethoxyethyl groups and (A2) a second polyhydroxy-styrene resin substituted at from 5 to 20% of the hydroxyl groups by 1-ethoxyethyl groups which are the same as in the first polyhydroxystyrene resin (A1), with the proviso that the ratio of the maximum weight-average molecular weight Mwmax to the minimum weight-average molecular weight Mwmin in the first and second polyhydroxystyrene resins (A1) and (A2) is smaller than 1.5.

1 more element

Dependencies are inferred from the claim text.