Method of chemical-vapor deposition of a material
AssigneeCVC Products, Inc.
InventorsAjit P. Paranjpe, Randhir S. Bubber, Sanjay Gopinath, Thomas R. Omstead, Mehrdad M. Moslehi
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AssigneeCVC Products, Inc.
InventorsAjit P. Paranjpe, Randhir S. Bubber, Sanjay Gopinath, Thomas R. Omstead, Mehrdad M. Moslehi
Estimating the term…
A method for chemical-vapor deposition of a material film adds precursor decomposition by-product to the precursor flow to suppress premature gas-phase precursor decomposition and improve process repeatability and film quality. In one embodiment, CVD cobalt films are deposited with carbonyl precursors with reduced premature gas-phase reaction and particulate generation by the addition of excess carbon monoxide to the process chamber comprising the precursor flow. The addition of carbon monoxide not only suppresses gas-phase reaction but also improves cobalt film purity. The addition of excess carbon monoxide to CVD cobalt precursor flow provides repeatable deposition of glue and nucleation layers to support CVD copper, and is extendable to the deposition of high purity CVD cobalt for other applications and with other precursors, and also extendable for CVD CoSi2 films and other cobalt-containing applications.
A method for chemical-vapor deposition of cobalt on a substrate diffusion barrier, the method comprising:
A method for chemical-vapor deposition of cobalt on a substrate diffusion barrier from a precursor, the precursor depositing the cobalt through chemical reactions that produces carbon monoxide, the method comprising:
A method for fabricating a copper structure on a substrate having a diffusion barrier, the method comprising:
Dependencies are inferred from the claim text.