Compositions for insulator and metal CMP and methods relating thereto
AssigneeRodel Holdings, Inc.
InventorsWesley D. Costas, James Shen
Life of this patent
Estimating the term…
Abstract
A composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising an organic polymer having a backbone comprised of at least 16 carbon atoms, the polymer having a plurality of moieties with affinity to surface groups on the semiconductor wafer surface. Another composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising a surfactant having a carbon chain backbone comprised of at least 16 carbon atoms.
Claims7
A composition useful for the polishing of integrated circuit surfaces comprising an organic polymer having a backbone comprised of at least 16 carbon atoms, said polymer having a plurality of moieties with affinity to surface groups on said semiconductor wafer surface.
A composition useful for the polishing of integrated circuit surfaces comprising a surfactant having a carbon chain backbone comprised of at least 16 carbon atoms.
A method of polishing a semiconductor wafer substrate, wherein said substrate is pressed against a polishing pad, said substrate and said pad are moved relative to each other, and a polishing composition is applied to said pad during the polishing operation, said polishing composition comprising an organic polymer having a backbone comprised of at least 16 carbon atoms, said polymer having a plurality of moieties with affinity to surface groups on said semiconductor wafer substrate.
A method of polishing a semiconductor wafer substrate, wherein said substrate is pressed against a polishing pad, said substrate and said are moved relative to each other, and a polishing composition is applied to said pad during the polishing operation, said polishing composition comprising a surfactant having a carbon chain backbone comprised of at least 16 carbon atoms.
Dependencies are inferred from the claim text.