Substrate process method and substrate process apparatus
AssigneeTokyo Electron Limited
InventorsHideyuki Takamori, Kiyohisa Tateyama, Kengo Mizosaki, Noriyuki Anai, Mitsuhiro Sakai, Shinobu Tanaka, Yoichi Honda, Yuji Shimomura
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Abstract
Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.
Claims7
A substrate process method for forming a particular film on a front surface of a substrate, comprising the steps of:
- (a) coating a solution on the front surface of a substrate and drying the substrate in a first atmosphere at a first reduced pressure;
- and
- (b) drying the substrate in a second atmosphere at a second reduced pressure in a non-heating state, the second reduced pressure being lower than the first reduced pressure.
Dependencies are inferred from the claim text.