Substrate mounting an integrated circuit package with a deformed lead

Abstract

In an integrated circuit package, a deformed IC lead is reliably connected with a land for mounting. Such reliable connection between the deformed IC lead and a land is realized by a method for mounting an integrated circuit package wherein a non deformed first lead and a deformed second lead in the integrated circuit package are connected to a first land and a second land on a substrate, respectively. comprising a step for supplying a conductive material on a land wherein a larger amount of the conductive material than that of the first land is supplied to the second land; and a step for melting the conductive material supplied to connect a lead with a land wherein the conductive material molten on the first land extends in the vertical direction with respect to the substrate with a first height thereby connecting the first lead with the first land, while the conductive material molten on the second land extends with a higher second height than the first height due to surface tension thereby connecting the second lead with the second land.

Dependencies are inferred from the claim text.