Embedded type flash memory structure and method for operating the same
AssigneeeMemory Technology Inc.
InventorsChing-Hsiang Hsu, Ching-Sung Yang
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Abstract
The present invention provides an embedded type flash memory structure and a method for operating the same. The memory structure of the present invention comprises a first deep doped-region formed on the surface of a semiconductor substrate. A second doped-region is implanted in the first deep doped-region. A plurality of first shallow doped-regions are respectively formed in the second doped-region and the first deep doped-region to be used as drains and sources. A dielectric insulating layer and a poly-silicon gate are stacked above the first deep doped-region between the source and the drain. The present invention also proposes programming, erasing, and reading processes corresponding to the flash memory cell structure.
Claims7
An embedded type flash memory structure, comprising:
- a semiconductor substrate;
- a first deep doped-region formed on the surface of said semiconductor substrate;
- a plurality of first shallow doped-regions formed in said first deep doped-region, wherein a first plurality of said plurality of first shallow doped-regions constitute transistor sources and a second plurality of first shallow doped-regions constitute transistor drains and wherein an ion penetration depth of said first deep doped-region is greater than that of said first shallow doped-regions;
- a plurality of second shallow doped-regions formed in said first deep doped-region wherein each of said plurality of second shallow doped-regions surrounds a corresponding one of said first shallow doped-regions, wherein said corresponding one of said first shallow doped-regions is one of said transistor drains, wherein each of said transistor sources is excluded from being surrounded by one of said plurality of second shallow doped-regions and wherein an ion penetration depth of said plurality of second shallow doped-regions is greater than that of said plurality of first shallow doped-regions and less than said penetration depth of said first deep doped-region;
- a dielectric insulating layer stacked above said first deep doped-region;
- and
- a poly-silicon layer constituting a gate formed on the surface of said dielectric insulating layer, wherein said gate mutually and simultaneously controls the electric field between a plurality of said transistor sources and a corresponding plurality of said transistor drains.
Dependencies are inferred from the claim text.