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US 6,441,386 B2Granted
Apparatus and method for mounting electronic component
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorHiroyuki Sakaguchi
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorHiroyuki Sakaguchi
Estimating the term…
Apparatus and method for mounting electronic components enhanced in mounting efficiency by eliminating loss time are disclosed. In the apparatus and method, electronic components are picked up from a supplying unit of the electronic components by a transfer head, and are mounted on a board. The height of components already mounted on the board being conveyed is measured by a height measuring unit comprising a CCD light sensor including a light emitting unit and a light receiving unit. In mounting operation, the transfer height of the transfer head when moving on the board is set to a height enough to keep an allowance to the already mounted components on the basis of the height measurement of components. As a result, without useless elevating motions of the transfer head, the loss time is eliminated and the mounting efficiency is enhanced.
An apparatus for mounting electronic component for picking up an electronic component from a supplying unit of an electronic component and mounting the electronic component on a board, by a transfer head, comprising:
A method for mounting electronic component for picking up an electronic component from a supplying unit of the electronic component and mounting the electronic component on a board, by a transfer head, comprising the steps of:
A method for mounting electronic component employing a plurality of apparatuses for mounting electronic component, each one of said plurality of apparatuses for mounting electronic component picking up an electronic component from a supplying unit of the electronic component and mounting the electronic component on a board by a transfer head,
Dependencies are inferred from the claim text.