Heating device, method for evaluating heating device and pattern forming method
AssigneeKabushiki Kaisha Toshiba
InventorsKei Hayasaki, Shinichi Ito, Kenji Kawano
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Abstract
A heating apparatus for performing heat treatment on a wafer applied with a resist before or after exposure includes a heating plate for heating a wafer which is placed on the heating plate, a light intensity detecting apparatus for irradiating light on the wafer to detect intensity of reflected light from the resist on the wafer, and a control section for controlling heating performed by the heating plate on the basis of the detected intensity of reflected light so that heating amount applied to a plurality of wafers becomes constant. Accordingly, the heating amount of the wafer can be controlled to be constant and variations in dimension of resist patterns can be reduced.
Claims14
A heating apparatus comprising:
- a heating device configured to heat a substrate having a resist formed thereon;
- a light intensity detecting device configured to irradiate visible light or ultraviolet light on the resist and to detect an intensity of a reflected light from the resist;
- and a heating controlling device configured to control heating performed by the heating device on the basis of the detected intensity of the reflected light.
A heating apparatus comprising:
- a heating device configured to heat a substrate having a resist formed thereon;
- a light intensity detecting device configured to irradiate visible light or ultraviolet light on a plurality of places of the resist and to detect intensities of reflected light from the respective places of the resist;
- and a heating controlling device configured to control heating performed by the heating device on the basis of a plurality of the detected intensities of the reflected lights.
Dependencies are inferred from the claim text.