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US 6,440,846 B1Granted
Method for forming semiconductor device
AssigneeOki Electric Industry Co., Ltd.
InventorMasahisa Ikeya
Life of this patent
Estimating the term…
Abstract
In a method for forming a semiconductor device, when polishing the wafer, the photo-resin so as to cure with ultraviolet is buried. Then, after polishing and forming the back side electrode, the photo-resin is removed by organic solvent. Accordingly, the method can improve reliability of bonding and simplify process flow without decreasing electrical characteristics.
Claims16
A method for forming a semiconductor device, comprising:
- providing a substrate having a first main surface and a second main surface opposite to the first main surface;
- forming a via-hole partially through the substrate such that an opening of the via-hole is at the first main surface of the substrate;
- forming a plated layer on a bottom surface and side surfaces of the via-hole;
- burying a photo-resin within the via-hole and on the plated layer;
- curing the photo-resin;
- polishing the second main surface of the substrate so as to remove a portion of the substrate and the plated layer formed on the bottom surface of the via-hole to expose the cured photo-resin;
- removing the cured photo-resin;
- and
- forming an electrode layer on the polished second main surface of the substrate so as to electrically connect the electrode layer to the plated layer formed on the side surfaces of the via-hole.
6 more elements
A method for forming a semiconductor device comprising:
- providing a substrate;
- forming a via-hole in the substrate;
- burying a photo-resin in the via-hole;
- curing the photo-resin;
- forming a conductive layer on the substrate and the cured photo-resin;
- and
- removing the cured photo-resin;
- wherein the conductive layer serving as an air bridge wiring.
5 more elements
A method for forming a semiconductor device, comprising:
- providing a substrate having a main surface;
- forming a via-hole partially through the substrate such that an opening of the via-hole is at the main surface of the substrate;
- filling the via-hole with a photo-resin and then curing the photo-resin within the via-hole;
- forming a conductive layer on the main surface of the substrate and over the cured photo-resin;
- and
- removing the cured photo-resin from the via-hole such that the conductive layer defines an air bridge wiring extending across the opening of the via-hole.
3 more elements
Dependencies are inferred from the claim text.