Polymeric compound and resin composition for photoresist

A polymeric compound comprising at least one monomeric unit represented by the following formula (I):

• wherein R1 is a hydrogen atom or a methyl group;
• and each of R2 and R3 is independently a hydrogen atom or a hydroxyl group;
• and at least one monomeric unit selected from the group consisting of:
• a monomeric unit represented by the following formula (III):
• wherein each of R1 and R9 is independently a hydrogen atom or a methyl group;
• a monomeric unit represented by the following formula (IV):
• wherein R10 is a tricyclo [5.2.1.02,6] decylmethyl group, a tetracyclo[4.4.0.12,5.17,10] dodecylmethyl group, a norbornyl group, an isobornyl group, or a 2-norbornylmethyl group, R11 is a substituent of R10 selected from the group consisting of a hydrogen atom, a hydroxyl group, a hydroxymethyl group, a carboxyl group, and a —COOR12 group, wherein R12 is a t-butyl group, a 2-tetrahydrofuranyl group, a 2-tetrahydropyranyl group, or an 2-oxepanyl group;
• and R1 has the same meaning as defined above;
• a monomeric unit represented by the following formula (Va) or (Vb):
• wherein each of R13, R14, R15, R16, R17, R18, R19, and R20 is independently a hydrogen atom or a methyl group, and R1 has the same meaning as defined above;
• and
• a monomeric unit represented by the following formula (VI):
• wherein n denotes an integer of 1 to 3;
• and R1 has the same meaning as defined above;
• and
• a monomeric unit represented by the following formula (VII):
• wherein R1 has the same meaning as defined above.