Method to facilitate processing of three dimensional substrates
AssigneeBall Semiconductor, Inc.
InventorRisaku Toda
Life of this patent
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Abstract
A method and system for securing a small spherical shaped semiconductor substrate for processing operations, such as lithography, is disclosed. The substrate is secured by attaching it to a member and applying an adhering substance, such as photo resist, to the substrate and a portion of the member. The application may be by electroplating or other means. The electroplated substance securely attaches the substrate to the member so that one or more processing operations may be performed on the substrate. After processing, the substrate can be removed from the member.
Claims13
A method for securing a substrate for a processing operation, the method comprising the steps of:
- positioning the substrate proximate to a member by applying a selectively attachable force between the substrate and the member, wherein the selectively attachable force is a vacuum;
- applying an adhering substance to the substrate and the member so that at least a portion of the adhering substance securely attaches the substrate to the member;
- performing the processing operation on the substrate while it is attached to the member;
- and
- removing the portion of adhering substance to separate the member from the substrate.
A method for securing a substrate for a processing operation, the method comprising the steps of:
- positioning the substrate proximate to a member;
- electroplating an adhering substance to the substrate and to the member, whereby the member is rigidly secured to the substrate and at least a portion of the adhering substance securely attaches the substrate to the member;
- performing the processing operation on the substrate while it is attached to the member;
- and
- removing the portion of adhering substance to separate the member from the substrate.
A method for performing lithography on a spherical substrate, the method comprising the steps of:
- releasably attaching the spherical substrate to a member, the member acting as an electrode for an electronic deposition process;
- inserting the spherical substrate and a portion of the member into a supply of photo resist;
- electronically depositing the photo resist to the spherical substrate and to the portion of the member so that the photo resist rigidly secures the spherical substrate to the member;
- and
- performing lithography on the spherical substrate while the substrate is rigidly secured to the member.
A method for performing lithography on a spherical substrate, the method comprising the steps of:
- releasably attaching the spherical substrate to a member by applying a selectively attachable force between the substrate and member;
- inserting the spherical substrate and a portion of the member into a supply of photo resist;
- electronically depositing the photo resist to the spherical substrate and to the portion of the member so that the photo resist rigidly secures the spherical substrate to the member;
- and
- performing lithography on the spherical substrate while the substrate is rigidly secured to the member.
A method for securing a substrate for a processing operation, the method comprising the steps of:
- positioning a member proximate to the substrate;
- applying a force to secure the member to the substrate;
- applying a first portion of adhering substance to the substrate and a second portion of adhering substance to the member so that the combined portions of adhering substance securely attaches the substrate to the member;
- releasing the force that secures the member to the substrate;
- after the force is released, performing the processing operation on the substrate while it is attached to the member by the adhering substance;
- and
- removing at least the second portion of the adhering substance to separate the member from the substrate.
Dependencies are inferred from the claim text.