IC substrate noise modeling with improved surface gridding technique

A method for performing surface modeling of an integrated circuit substrate for the purpose of characterizing the integrated circuit substrate, comprising:

• initially dividing a representation of a surface of said integrated circuit substrate into a plurality of local partitions;
• thereafter forming divisions from said plurality of local partitions;
• removing a representation of a first component from a first location on said representation of said surface of said integrated circuit substrate;
• and
• removing divisions from within one or more of said plurality of local partitions that previously overlapped the representation of the first component;
• wherein forming divisions from said plurality of local partitions comprises applying an overgridding factor and an overgridding resolution, the overgridding factor defining a number of divisions to be created for each distance defined by the overgridding factor.

A method for performing surface modeling of an integrated circuit substrate for the purpose of characterizing the integrated circuit substrate, comprising:

• initially dividing a representation of a surface of said integrated circuit substrate into a plurality of local partitions;
• thereafter forming divisions from said plurality of local partitions;
• positioning a representation of a first component at a first location on said representation of said surface of said integrated circuit substrate;
• determining whether the first component overlaps one or more of the plurality of local partitions;
• and
• when it is determined that the representation of the first component overlaps one of the plurality of local partitions, further partitioning the one or more of the local partitions into new divisions;
• wherein forming divisions from said plurality of local partitions comprises applying an overgridding factor and an overgridding resolution, the overgridding factor defining a number of divisions to be created for each distance defined by the overgridding resolution.

A computer readable medium for performing surface modeling of an integrated circuit substrate for the purpose of characterizing the substrate, the computer readable medium comprising:

• instructions for initially dividing a representation of said integrated circuit substrate surface into a plurality of local partitions;
• instructions for thereafter forming divisions from said plurality of local partitions;
• instructions for positioning a representation of a first component at a first location on said representation of said integrated circuit substrate surface, thereby creating additional divisions within one of said plurality of local partitions;
• and
• instructions for if a number of divisions within said one of said plurality of local partitions exceeds a predefined value, promoting said one of said plurality of local partitions to a global partition and forming local partitions within said one of said plurality of local partitions;
• wherein forming divisions from said plurality of local partitions comprises applying an overgridding factor and an overgridding resolution, the overgridding factor defining a number of divisions to be created for each distance defined by the overgridding resolution.

A computer reading medium for performing surface modeling of an integrated circuit substrate for the purpose of characterizing the integrated circuit substrate, comprising:

• instructions for initially dividing a representation of a surface of said integrated circuit substrate into a plurality of local partitions;
• instructions for thereafter forming divisions from said plurality of local partitions by applying an overgridding factor and an overgridding resolution, the overgridding factor defining a number of divisions to be created for each distance defined by the overgridding resolution;
• instructions for removing a representation of a first component from a first location on said representation of said surface of said integrated circuit substrate;
• and
• instructions for removing divisions from within one or more of said plurality of local partitions that previously overlapped the representation of the first component.

A computer reading medium for performing surface modeling of an integrated circuit substrate for the purpose of characterizing the integrated circuit substrate, comprising:

• instructions for initially dividing a representation of a surface of said integrated circuit substrate into a plurality of local partitions;
• instructions for thereafter forming divisions from said plurality of local partitions by applying an overgridding factor and an overgridding resolution, the overgridding factor defining a number of divisions to be created for each distance defined by the overgridding resolution;
• instructions for positioning a representation of a first component at a first location on said representation of said surface of said integrated circuit substrate;
• instructions for determining whether the representation of the first component overlaps one or more of the plurality of local partitions;
• and
• instructions for when it is determined that the representation of the first component overlaps one of the plurality of local partitions, further partitioning the one or more of the local partitions into new divisions.

An apparatus for performing surface modeling of an integrated circuit substrate for the purpose of characterizing the integrated circuit substrate, comprising:

• a processor;
• and
• a memory, at least one of the processor and the memory being adapted for:
• initially dividing said representation of said integrated circuit substrate surface into a plurality of local partitions;
• thereafter forming divisions from said plurality of local partitions by applying an overgridding factor and an overgridding resolution, the overgridding factor defining a number of divisions to be created for each distance defined by the overgridding resolution;
• positioning a representation of a first component at a first location on said representation of said integrated circuit substrate surface, thereby creating additional divisions within one of said plurality of local partitions;
• and
• if a number of divisions within said one of said plurality of local partitions exceeds a predefined value, promoting said one of said plurality of local partitions to a global partition and forming local partitions within said one of said plurality of local partitions.

An apparatus for performing surface modeling of an integrated circuit substrate for the purpose of characterizing the integrated circuit substrate, comprising:

• a processor;
• and
• a memory, at least one of the processor and the memory being adapted for:
• initially dividing a representation of a surface of said integrated circuit substrate into a plurality of local partitions;
• thereafter forming divisions from said plurality of local partitions by applying an overgridding factor and an overgridding resolution, the overgridding factor defining a number of divisions to be created for each distance defined by the overgridding resolution;
• removing a representation of a first component from a first location on said representation of said surface of said integrated circuit substrate;
• and
• removing divisions from within one or more of said plurality of local partitions that previously overlapped the representation of the first component.

An apparatus for performing surface modeling of an integrated circuit substrate for the purpose of characterizing the integrated circuit substrate, comprising:

• a processor;
• and
• a memory, at least one of the processor and the memory being adapted for:
• initially dividing a representation of a surface of said integrated circuit substrate into a plurality of local partitions;
• thereafter forming divisions from said plurality of local partitions by applying an overgridding factor and an overgridding resolution, the overgridding factor defining a number of divisions to be created for each distance defined by the overgridding resolution;
• positioning a representation of a first component at a first location on said representation of said surface of said integrated circuit substrate;
• determining whether the representation of the first component overlaps one of more of the plurality of local partitions;
• and
• when it is determined that the representation of the first component overlaps one of the plurality of local partitions, further partitioning the one or more of the local partitions into new divisions.