Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof

A cooling assembly for an electronic module, said cooling assembly comprising:

• a thermally conductive cavity plate having a first main surface and a second main surface with at least one blind hole formed in said second main surface extending towards said first main surface, wherein each blind hole has a lower surface and a side surface, said lower surface and said side surface connecting at a non-orthogonal angle to facilitate the flow of fluid therealong;
• at least one jet nozzle, each jet nozzle being sized to reside within a respective blind hole of said at least one blind hole in said cavity plate, wherein fluid introduced into said cavity plate through a jet nozzle of said at least one jet nozzle impinges upon said lower surface of said respective blind hole and flows outward through a space defined between said side surface of said blind hole and a side surface of said jet nozzle, wherein said non-orthogonal angle between said lower surface and said side surface of said blind hole facilitates fluid flow, after impinging upon said lower surface, outward through said space defined between said side surface of said blind hole and said side surface of said jet nozzle;
• wherein said at least one blind hole comprises a plurality of blind holes formed in said second main surface extending toward said first main surface of said cavity plate, and wherein said at least one jet nozzle comprises a plurality of jet nozzles, each jet nozzle being sized to reside within a respective blind of said plurality of blind holes in said cavity plate;
• and
• wherein at least one jet nozzle of said plurality of jet nozzles has a side surface with a plurality of radial channels disposed therein, said radial channels comprising said space defined between said side surface of said blind hole and said side surface of said jet nozzle, wherein fluid delivered through said at least one jet nozzle impinges upon said lower surface of said respective blind hole and flows outward through said plurality of radial channels.

A cooling assembly for an electronic module, said cooling assembly comprising:

• a thermally conductive cavity plate having a first main surface and a second main surface with at least one blind hole formed in said second main surface extending towards said first main surface, wherein each blind hole has a lower surface and a side surface;
• at least one jet nozzle, each jet nozzle being sized to reside within a respective blind hole in said cavity plate, wherein fluid introduced into said cavity plate through a jet nozzle of said at least one jet nozzle impinges upon said lower surface of said respective blind hole and flows outward through a space defined between said side surface of said blind hole and a side surface of said jet nozzle;
• and
• wherein a jet nozzle of said at least one jet nozzle comprises a side surface having a plurality of radial channels disposed therein, wherein said space defined between said side surface of said blind hole and said side surface of said jet nozzle comprises said plurality of radial channels, and wherein fluid delivered through said jet nozzle impinges upon said lower surface of said respective blind hole and flows outward from said blind hole at least partially through said plurality of radial channels disposed within said jet nozzle.

A cooling assembly for an electronic module, said cooling assembly comprising:

• a thermally conductive cavity plate having a first main surface and a second main surface with at least one blind hole formed in said second main surface extending towards said first main surface, wherein each blind hole has a lower surface and a side surface, said lower surface and said side surface connecting at a non-orthogonal angle to facilitate the flow of fluid therealong;
• at least one jet nozzle, each jet nozzle being sized to reside within a respective blind hole of said at least one blind hole in said cavity plate, wherein fluid introduced into said cavity plate through a jet nozzle of said at least one jet nozzle impinges upon said lower surface of said respective blind hole and flows outward through a space defined between said side surface of said blind hole and a side surface of said jet nozzle;
• wherein within each blind hole said lower surface and said side surface thereof connect via a curved surface which facilitates outward transfer of fluid to said space between said side surface of said blind hole and said side surface of said jet nozzle after said fluid has impinged upon said lower surface;
• and
• wherein each jet nozzle further comprises a lower surface, said lower surface meeting said side surface of said jet nozzle at a curved portion to facilitate the flow of fluid delivered through said jet nozzle from said blind hole after impinging upon said lower surface of said blind hole, wherein the curved portion inhibits recirculation of fluid flowing along the lower surface to the side surface of the jet nozzle.

A method of fabricating a cooling assembly for an electronic module, said method comprising:

• providing a thermally conductive cavity plate having a first main surface and a second main surface with a plurality of blind holes formed in said second main surface extending toward said first main surface, wherein each blind hole has a lower surface and side surface;
• providing a plurality of jet nozzles, multiple jet nozzles including radially extending pedestals on a side surface thereof which are sized to physically contact said surface of said respective blind hole when said jet nozzles are disposed at least partially therein;
• and
• separately interference fitting each jet nozzle of said multiple jet nozzles of said plurality of jet nozzles into a respective blind hole of said plurality of blind holes, wherein fluid introduced into said cavity plate through said multiple jet nozzles of said plurality of jet nozzles impinges upon said lower surface of said respective blind hole and flows outward through a space defined between said side surface of said blind hole and said side surface of said jet nozzle, and wherein said radially extending pedestals physically contacting said side surface of said blind hole define a size of said space between said side surface of said blind hole and said side surface of said jet nozzle.

A method of fabricating a cooling assembly for an electronic module, said method comprising:

• providing a thermally conductive cavity plate having a first main surface and a second main surface with a plurality of blind holes formed in said second main surface extending toward said first main surface, wherein each blind hole has a lower surface and a side surface, and radially inwardly extending fins disposed along said side surface;
• providing a plurality of jet nozzles, each jet nozzle including radially outwardly extending fins on a side surface thereof configured to interdigitate with said inwardly extending fins on said side surface of a respective blind hole when said jet nozzle is disposed within said blind hole, with a gap being defined between said interdigitated fins;
• and
• disposing each jet nozzle of said plurality of jet nozzles within said respective blind hole of said plurality of blind holes, wherein fluid introduced into said cavity plate through each jet nozzle of said plurality of jet nozzles impinges upon said lower surface of said respective blind hole and flows outward through said gap defined between said interdigitated fins of said side surface of said blind hole and said jet nozzle.