Resistors for electronic packaging
AssigneeMicroCoating Technologies, Inc.
InventorsAndrew T. Hunt, Wen-Yi Lin, Shara S. Shoup
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Abstract
In thin layer resistors comprising a patch of a layer of resistive material on an insulating substrate and means at spaced apart locations on the patch, the resistive material is formed of 95 to 99.5 wt % of a zero valence metal and between 5 and 0.5 wt % of a dielectric material.
Claims36
An electrical resistor comprising a layer of resistor material having pores at about 1 micron or less on an insulating substrate and means at spaced-apart locations on said layer of resistor material for electrical connection of said layer of resistor material, said resistor consisting essentially of a homogeneous mixture of between about 80 and about 99.9 wt % of a zero valence metal or an alloy of zero valence metals and between about 20 and about 0.1 wt % of a dielectric material which is a metal oxide or metalloid oxide.
A layer of electrically resistive material having pores at about 1 micron or less consisting essentially of a homogeneous mixture of between about 80 and about 99.9 wt % of zero valence metal or an alloy of zero valence metals and between about 0.1 and about 20 wt % of dielectric material which is a metal oxide or a metalloid oxide.
Dependencies are inferred from the claim text.