Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms
AssigneeNortel Networks Limited
InventorsAleksandar Vukovic, Tim A. Venus, Howard J. Rajala, Douglas B. Cross, Paul van Leeuwen, Kim Roberts
Life of this patent
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Abstract
An apparatus for providing liquid cooling to high power high capacity, switching, transport and processing equipment is disclosed. The electronics of such equipment is typically contained in metal electronics modules, with the heat being directed to the walls of the modules. A pair of cooling plates with integral coolant flow through is pressed against the metal module walls with pressure. The cooling plates remain part of the shelf and the metal electronics modules can be removed for repair, exchange or upgrade.
Claims14
An apparatus for cooling of an electronic module in a shelf unit comprising:
- at least first and second cold plates, each cold plate comprising an inlet and an outlet for coolant flow, said first and second cold plates adapted to receive the module therebetween;
- and
- a mechanism for moving the first and second cold plates towards and away from the module into operating and released positions respectively relative to the module when positioned therebetween such that:
- (a) when the cold plates have moved toward the module into the operating position, a surface of each said cold plate comes into heat transferring relationship with an associated surface of the module so that, in use, as a coolant flows through each cold plate, heat is transferred from the module to the coolant in each cold plate, and
- (b) when the first and second cold plates have been moved away from the module into the released position, the module is spaced from the cold plates to enable the module to be readily removed from between the cold plates.
An electronic shelf unit for mounting a plurality of electronic modules, the shelf unit having mounting means for removably electrically connecting an electronic module, and comprising an associated cooling apparatus for cooling of the electronic module, the cooling apparatus comprising:
- at least first and second cold plates, each cold plate comprising an inlet and an outlet for coolant flow, said first and second cold plates adapted to receive the module therebetween;
- and
- a mechanism for moving the first and second cold plates towards and away from the module into operating and released positions respectively relative to the module when positioned therebetween such that:
- (a) when the cold plates have moved toward the module into the operating position, a surface of each said cold plate comes into heat transferring relationship with an associated surface of the module so that, in use, as a coolant flows through each cold plate, heat is transferred from the module to the coolant in each cold plate, and
- (b) when the first and second cold plates have been moved away from the module into the released position, the module is spaced from the cold plates to enable the module to be readily removed from between the cold plates.
An electronic shelf unit for mounting a plurality of electronic modules, the shelf unit having mounting means for removably electrically connecting an electronic module, and comprising an associated cooling apparatus for cooling of the electronic module, the cooling apparatus comprising:
- at least first and second cold plates, each cold plate comprising an inlet and an outlet for coolant flow, said first and second cold plates adapted to be positioned on opposing sides of the module, a surface of each said cold plate being in close heat transferring relation to an associated surface of the module;
- and
- a biasing mechanism to provide pressure capable of forcing the first and second cold plates towards the module to provide said close heat transferring relation between the plates and the module whereby as a cooling coolant flows from the inlet of each cold plate to the outlet of each cold plate, heat is transferred from the module to the coolant in each cold plate when in use, the biasing mechanism including:
- (a) a tool clamp mounted to one of said cold plates;
- and
- (b) a slide plate positioned along the first and second cold plates, the slide plate being pinned to the first and second cold plates through angled slots, the tool clamp being pivotally attached to the slide plate such that actuation of the tool clamp causes the slide plate to move towards the tool clamp thereby applying pressure forcing the first and second cold plates towards a module positioned therebetween.
Dependencies are inferred from the claim text.