Testing electronic devices
AssigneeKaitech Engineering, Inc.
InventorHsu Kai Yang
Life of this patent
Estimating the term…
Abstract
A test assembly contains a plurality of electronic devices that are attached to a lead frame. Leads of the electronic devices are trimmed from the lead frame to electrically isolate the leads. At least a portion of the lead frame is mounted into a socket in the test assembly.
Claims24
A method of assembling and testing electronic device units, comprising:
- attaching the electronic device units to a strip;
- mounting at least a portion of the strip in a test socket that includes conductors electrically coupled to the electronic device units on the strip portion;
- providing test signals to the test socket to test the electronic device units;
- marking electronic device units based on the test;
- and
- encapsulating the electronic device units on the strip and separating leads of the electronic device units from the strip.
A test assembly for testing electronic devices, comprising:
- a plurality of sockets;
- lead frame portions mounted in corresponding sockets, each lead frame portion being attached to a plurality of electronic devices, and each electronic device having at least a pin separated from the lead frame portion,
- the lead frame portions being cut from a single lead frame,
- wherein the electronic devices are arranged in a matrix in each lead frame portion.
A method of forming a test assembly containing a plurality of electronic devices, comprising:
- attaching the electronic devices in a two-dimensional matrix to a lead frame;
- trimming leads of the electronic devices from the lead frame to electrically isolate the leads;
- mounting at least a portion of the lead frame into a socket in the test assembly;
- and
- encapsulating the electronic devices after they have been attached to the lead frame.
A tester for testing electronic devices, comprising:
- test assemblies;
- ports to receive the test assemblies;
- and
- a multiplexer and driver array to select one or more of the ports to receive test signals,
- each test assembly including a socket and a strip portion mounted in the socket and attached to a plurality of electronic devices and arranged to enable DC testing.
A method of making electronic device units, comprising:
- attaching the electronic device units to a lead frame;
- trimming leads of the electronic device units from the lead frame;
- mounting at least a portion of the lead frame into a socket in a test assembly;
- performing a DC test of each electronic device unit;
- performing a functional test of each electronic device;
- and
- separating the electronic device units from the lead frame.
A test apparatus comprising:
- a lead frame portion on which are attached a plurality of electronic device units each having one or more pins;
- a socket in which the lead frame portion may be mounted, the socket having conductors electrically coupled to corresponding pins of the electronic device units;
- and
- a support structure containing conductive lines coupled to the socket and arranged to enable DC tests of an electronic device unit group less than all of the electronic device units.
Dependencies are inferred from the claim text.