Circuit board packaging structure
AssigneeFujitsu Limited
InventorsHiroyuki Otaguro, Takayuki Ashida, Hitoshi Yokemura, Hidenao Nakajima, Yoshimi Watanabe, Shuuhei Fujita
Life of this patent
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Abstract
A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.
Claims9
A circuit board packaging structure comprising:
- a plurality of circuit boards each packaged with electric circuit parts and disposed in parallel to each other, wherein a circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on other circuit boards of said plurality of circuit board is disposed outermost among said plurality of circuit boards and, at the same time, disposed so that the surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside;
- a first cooling fan for flowing cooling air from outside of the structure along said plurality of circuit boards to cool off the electric circuit parts packaged on said plurality of circuit boards;
- and
- a second cooling fan for pulling said cooling air in a direction from said first cooling fan along said circuit board toward the outside of the structure.
A circuit board packaging comprising:
- a plurality of circuit boards each packaged with electric circuit parts and disposed in parallel to each other, wherein a circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on other circuit boards of said plurality of circuit board is disposed outermost among said plurality of circuit boards and, at the same time, disposed so that the surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside;
- a first cooling fan for flowing cooling air along said plurality of circuit boards to cool off the electric circuit parts packaged on said plurality of circuit boards;
- a plate for collecting cooling air from said first cooling fan, bended to gather air, disposed outside of said circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity;
- and
- a second cooling fan for blowing said cooling air from said first cooling fan against said circuit board disposed outermost among said plurality of circuit boards from a direction perpendicular to said circuit board to cool off said electric circuit parts exhibiting the larger exothermic quantity, mounted on said plate.
Dependencies are inferred from the claim text.