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US 6,388,339 B1Granted
Sealed-by-resin type semiconductor device and liquid crystal display module including the same
AssigneeSharp Kabushiki Kaisha
InventorsSeiichi Yamamoto, Miki Fujiyoshi
Life of this patent
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Abstract
A sealed-by-resin type semiconductor device includes a substrate, a lead provided on the substrate, and a semiconductor element provided on the lead by flip chip bonding. The semiconductor element includes a plurality of terminals connected to the lead. The sealed-by-resin type semiconductor device further includes a resin for protecting the plurality of terminals, and the resin has a sufficiently low elasticity modulus that occurrence of undesirable migration is suppressed.
Claims8
A seal-by-resin type semiconductor device comprising:
- a substrate;
- a lead provided on the substrate;
- and
- a semiconductor element provided on the lead by flip chip bonding,
- wherein the semiconductor element includes a plurality of terminals connected to the lead;
- the sealed-by-resin type semiconductor device further comprising a resin for protecting the plurality of terminals;
- wherein the resin has a sufficiently low elasticity modulus so that occurrence of undesirable migration is suppressed;
- and
- wherein the resin includes a denatured polyimide resin, and the denatured polyimide resin includes aromatic tetracarboxylic acid and aromatic diamine.
6 more elements
A liquid crystal display module comprising:
- a sealed-by-resin type semiconductor device including:
- a substrate;
- a lead provided on the substrate;
- and
- a semiconductor element provided on the lead by flip chip bonding,
- wherein the semiconductor element includes a plurality of terminals connected to the lead;
- the sealed-by-resin type semiconductor device further including a resin for protecting the plurality of terminals;
- wherein the resin has a sufficiently low elasticity modulus so that occurrence of undesirable migration is suppressed;
- a liquid crystal display element coupled to the substrate;
- and
- wherein the resin includes a denatured polyimide resin, and the denatured polyimide resin includes aromatic tetracarboxylic acid and aromatic diamine.
8 more elements
Dependencies are inferred from the claim text.