Semiconductor device with a passivation film
AssigneeMurata Manufacturing Co., Ltd.
InventorsHiroyuki Seto, Shogo Yoshida
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Abstract
The invention provides a semiconductor device with a passivation film provided on a surface thereof, said passivation film comprising a SiON layer in contact with the surface of said semiconductor device, and a Si3N4 layer provided at the outer side of said SiON layer, chraracterized in that said passivation film has an outermost layer of Si3N4 and said outermost layer has a portion in contact with said semiconductor device or the exposed area of said SiON layer is nitrided. The semiconductor device has a high bonding strength between the passivation film and the semiconductor device and high moisture resistance.
Claims4
A semiconductor device with a laminated passivation film, comprising:
- a semiconductor substrate having a semiconductor device at a portion of a surface thereof, the semiconductor device having an electrode on the semiconductor substrate,;
- and
- a laminated passivation film on a surface of the semiconductor substrate covering the semiconductor device, the laminated passivation film including an innermost insulation layer of SiON which covers the entire of the semiconductor device and is in contact with the surface of the semiconductor substrate and an outermost insulation layer of Si3N4 which covers the innermost insulation layer entirely such that no portion of the innermost insulation layer is exposed and said outermost layer in contact with the surface of the semiconductor substrate
- wherein the laminated passivation film has an opening which exposes a portion of the electrode and the outermost insulation layer is in contact with the electrode at a periphery of the opening.
Dependencies are inferred from the claim text.