Application of an ozonated DI water spray to resist residue removal processes
AssigneeTexas Instruments Incorporated
InventorsNeal T. Murphy, Claire Ching-Shan Jung, Danny F. Mathews
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Abstract
A method and apparatus for resist strip. Wafers (108) with a patterned resist formed thereon are placed in a carrier (104) in a process chamber (102). An ozonated deionized water mist (120) is sprayed on the surface of wafer (108). The ozonated deionized water mist (120) strips the resist and removes the resist residue without the use of hazardous chemicals. The ozonated deionized water mist (120) may be formed in an atomizer that mixes deionized water (116) with ozone (118). The ozonated deionized water mist (120) is then sprayed onto the wafers (108) while the wafers are being rotated.
Claims4
A method for fabricating an integrated circuit, comprising the steps of:
- providing a semiconductor wafer with a resist pattern formed thereon;
- placing said semiconductor wafer in a process chamber;
- and
- spraying an ozonated deionized water mist to a surface of said semiconductor wafer to remove said resist pattern while rotating said semiconductor wafer alternately in a clockwise direction and a counterclockwise direction.
Dependencies are inferred from the claim text.