Integrated circuit defect detection via laser heat and IR thermography
AssigneeAdvanced Micro Devices, Inc.
InventorsBrennan V. Davis, Rama R. Goruganthu, Jeffrey D. Birdsley, Michael R. Bruce, Rosalinda M. Ring
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Abstract
Defect detection for post-manufacturing analysis of an integrated circuit die is enhanced via a method and system that use IR thermography to detect defects in circuitry within the die. According to an example embodiment of the present invention, substrate is removed from an integrated circuit die and a target region is exposed. A portion of the target region is heated with an infrared (IR) laser beam, and the die is imaged using IR thermography. The image is compared with a reference image, and damage to the integrated circuit is detected therefrom.
Claims20
A method for detecting circuit damage in an integrated circuit die, the method comprising:
- removing substrate from the die and exposing a target region;
- heating a portion of the target region with an infrared (IR) laser beam;
- imaging the target region via IR thermography;
- and
- comparing the image of the target region to a reference image and determining therefrom circuit damage.
A system for detecting circuit damage in an integrated circuit die, the system comprising:
- means for removing substrate from the die and exposing a target region;
- means for heating a portion of the target region with an infrared (IR) laser beam;
- means for imaging the target region via IR thermography;
- and
- means for comparing the image of the target region to a reference image and determining therefrom circuit damage.
A method for detecting circuit damage in an integrated circuit die having circuitry, the method comprising:
- using a FIB, removing substrate from the die and exposing a target region;
- directing an IR laser at the target region and spot-heating a portion of the target region including target circuitry;
- using IR thermography and generating an image of the target circuitry;
- using a laser scanning microscope to compare the generated image of the target circuitry to a reference image of the target circuitry;
- and
- responsive to detecting discrepancies in the generated image of the target circuitry, detecting circuit damage.
Dependencies are inferred from the claim text.