Substrate for transfer mask and method for manufacturing transfer mask by use of substrate
AssigneeHoya Corporation
InventorIsao Amemiya
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Abstract
A substrate for transfer masks and a method of manufacture for transfer masks are provided with which short manufacturing time, and shorter TAT can be realized. Alignment marks 5, a rear surface concavity 6, a dry etching stopper layer, and a slit 7 for cross-sectioning are formed in the substrate for transfer masks 10, padding 8 pads slit 7 for cross-sectioning and rear surface concavity 6, and a plate 11 is affixed with glue 9 in advance.
Claims11
A method for manufacturing a transfer mask which comprises a thin film having an aperture pattern therein and a supporting frame to support said thin film;
- said method being included in a process for manufacturing a semiconductor device;
- said process comprising a first process for designing a device pattern, a second process for manufacturing a plurality of masks including said transfer mask in accordance with said device pattern, and a third process for transferring said device pattern from said masks onto a substrate to be transferred thereon,
- wherein at least a process for forming an alignment mark on said supporting frame of a supporting substrate and a process for achieving a structure having a rear groove beneath said thin film in such a manner that a rear side of said supporting substrate is partially removed at a location which is aligned with said alignment mark are performed prior to obtaining a design information of said device pattern, and a process for forming said aperture pattern is performed in accordance with said device pattern at said location after obtaining said design information.
A method for manufacturing a transfer mask which comprises a thin film having an aperture pattern therein and a supporting frame to support said thin film;
- said method being included in a process for manufacturing a semiconductor device;
- said process comprising a first process designing a device pattern, a second process for manufacturing a plurality of masks including said transfer mask in accordance with said device pattern, and a third process for transferring said device pattern from said masks onto a substrate to be transferred thereon,
- wherein said method comprises a process for preparing a substrate for transfer mask having an alignment mark on said frame of a supporting substrate and a rear groove beneath said thin film constituted in such a manner that a rear side of said supporting substrate is partially removed prior to obtaining a design information of said device pattern at a location which is aligned with said alignment mark.
Dependencies are inferred from the claim text.