Low cost die sized module for imaging application having a lens housing assembly

Abstract

An imaging sensor module assembly adapted to be mounted to a substrate for use in electronic imaging devices. The imaging sensor includes an optical lens, and a sensor package having a sensor surface containing an optical detector portion. The sensor further includes a plurality of sensor contacts in electrical communication with the optical detector portion. A flex circuit includes a plurality of circuits terminating at respective terminals electrically coupled to a corresponding sensor contact. The module assembly further includes a lens housing assembly configured to support the optical lens, and a barrel portion adapted to fixedly couple to the sensor package. This coupling orients the lens a predetermined focal length from the sensor package such that light waves passing through the lens are focused onto the optical detector portion.

Dependencies are inferred from the claim text.