Method for improving the dimple phenomena of a polysilicon film deposited on a trench

Abstract

In the invention, a photoresist layer is first spread on a semiconductor structure, and then using a photomask with a specially designed pattern exposes the photoresist layer. Next, the photoresist layer is developed to form a patterned photoresist layer. Thereafter, using the patterned photoresist layer as a mask, a trench is formed in the semiconductor structure by selective etching. The pattern of the photomask according to the invention is formed as in the following steps. At first, a first pattern extending in a first direction and having a first side and a second side that is opposite to the first side is formed. Next, a second pattern extending in a second direction that is perpendicular to the first direction is formed in such a way that an end of the second pattern is connected with the first side of the first pattern. Thereafter, a concave edge is formed on the second side to substantially face the second pattern. The distance between the first side and the second side is shortened due to the presence of the concave edge. As a result, the depth of the dimples developed at the intersection points of the dimple lines is greatly reduced when a polysilicon layer is deposited on the trench formed according to the invention.

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