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US 6,335,229 B1Granted

Inductive fuse for semiconductor device

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Abstract

A method and structure for blowing a fuse including removing an insulator above a fuse link and etching the fuse link.

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Facts

Application: 09/417,289Filed 13 Oct 1999
Granted: 1 Jan 2002
Term ends: Not estimatedThe source records don’t support an estimate.

Classification3 codes

H10W 20/493
Adaptable interconnections, e.g. fuses or antifuses: fuses, i.e. interconnections changeable from conductive to non-conductive
H10W 20/497
Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes: inductive…
H10W
Generic packages, interconnections, connectors or other constructional details of devices covered by

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