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US 6,333,546 B1Granted
Micro fusible link for semiconductor devices and method of manufacture
AssigneeInternational Business Machines Corporation
InventorsPatricia Marmillion, Anthony M. Palagonia, Dennis A. Schmidt
Life of this patent
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Abstract
An electrically activated fuse with a high melting point heater element in series with a low melting point fusible link. The heater element has a higher resistivity and larger cross-sectional area than the fusible link in order to withstand heat that the heater element generates bringing the fusible link to its melting point. Fuse dimensions (width and length) are each between 0.1 and 2.0 microns, with a thermal mass of the heater element being sufficient to melt the fusible link.
Claims6
A fusible link comprising:
- a resistive element;
- a fusible element contacting said resistive element, whereby a programming current passing through said resistive element and said fusible element heats said resistive element to a temperature at least at the melting point of said fusible element, heat from said resistive element and said programming current opening said fusible element.
Dependencies are inferred from the claim text.