Heat treating method and heat treating apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsHideaki Sakurai, Shinichi Ito, Iwao Higashikawa, Akitoshi Kumagae
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Abstract
Disclosed is a heat treating method for heating a target substrate by means of light irradiation, in which a light irradiation treatment is applied to the target substrate a plurality of times such that adjacent light irradiated regions on the target substrate partially overlap with each other and that the adjacent light irradiated regions do not overlap with each other in the light irradiating periods.
Claims3
A heat treating method for heating a target substrate by means of light irradiation, wherein a light irradiation treatment is applied a plurality of times to said target substrate such that the adjacent light irradiating regions of said target substrate are allowed to partially overlap each other and that the light irradiating periods of the adjacent light irradiating regions do not overlap with each other.
Dependencies are inferred from the claim text.