Process of ensuring detect free placement by solder coating on package pads

A process of packaging an integrated circuit component to form a reflowed integrated circuit package assembly comprising:

• providing a package substrate having an integrated circuit component receiving area having substrate interconnect pads and high-melting solder balls, said high-melting solder balls being disposed on less than all of the substrate interconnect pads, and said high-melting solder balls forming a pattern detectable by machine vision;
• providing an integrated circuit component having component contact pads and eutectic solder balls, said eutectic solder balls being disposed on said component contact pads in a pattern complementary to the high-melting solder balls on the package substrate;
• positioning the package substrate on an integrated circuit component placement device having machine vision;
• imaging the high-melting solder balls using the machine vision of the integrated circuit component placement device;
• positioning the integrated circuit component on the package substrate so that the eutectic solder balls rest on substrate interconnect pads and high-melting solder balls contact component contact pads, thereby forming an integrated circuit package assembly;
• heating the integrated circuit package assembly to a temperature sufficient to cause the eutectic and high-melting solder balls to melt and reflow, thereby forming connections between the integrated circuit component and the package substrate;
• and
• cooling the integrated circuit package assembly to form a reflowed integrated circuit package assembly.