Peelable lead structure and method of manufacture
AssigneeTessera, Inc.
InventorsDavid Light, John W. Smith
Life of this patent
Estimating the term…
Abstract
A microelectronic component connection is made by providing a lead, extending along the surface of a first element such as a semiconductor chip or wafer, such that at least a part of the lead adheres to the surface of the first element. The adhesion between this part of the lead and the surface of the first element is released by altering the temperature of at least this part of the lead. This part of the lead can then be peeled away from the surface of the first element. This part of the lead may be connected to a second element such as a microelectronic connection component, and the lead may be deformed by moving the elements relative to one another.
Claims47
A method of making a microelectronic connection comprising:
- (a) providing a first element having a surface and a lead extending along such surface, said lead having a first end and a second end, said second end of said lead adhering to said surface;
- and
- (b) releasing the adhesion between the second end of the lead and the surface by altering the temperature of at least the second portion of the lead.
A method of bonding a lead to a contact comprising:
- (a) providing a lead partially overlying a contact and a bonding material on at least one of said lead and said contact;
- (b) liquefying at least a portion of said bonding material so that said liquid bonding material forms a droplet in contact with said lead and said contact and so that said bonding material moves at least that portion of the lead adjacent said contact relative to said contact so as to increase the degree of overlap of said lead and said contact.
The method as claimed in 23 wherein said step of releasing the adhesion is performed after said juxtaposing step.
A method of making a microelectronic assembly comprising:
- (a) providing a dielectric substrate having a first surface and a lead adhered to said first surface at least at a tip end of said lead;
- (b) connecting said tip end of said lead to an electrical contact on a contact-bearing surface of a microelectronic component thereby creating a microelectronic assembly;
- and
- (c) altering the temperature of said tip ends of said lead and said substrate through a temperature range sufficient to cause the tip end of the lead to separate from said substrate first surface.
Dependencies are inferred from the claim text.