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US 6,324,075 B1Granted
Partially covered motherboard with EMI partition gateway
AssigneeIntel Corporation
InventorsEdgar J. Unrein, Minh T. Le, Chris H. Hanes, Ron D. Egger
Life of this patent
Estimating the term…
Abstract
An improved assembly for a computer that includes a motherboard having a first side and a second side. The first side has a first portion and a second portion. The first portion contains components capable of generating substantial heat and a strong electric field. The assembly further includes an EMI attenuating cover that encloses the first portion of the first side of the motherboard, but does not enclose the second portion of the first side of the motherboard.
Claims17
An assembly for a computer comprising:
- a motherboard having a first side and a second side, the first side having a first portion and a second portion, the first portion containing components capable of generating substantial heat and a strong electric field;
- an EMI attenuating cover that encloses the first portion of the first side of the motherboard, but does not enclose the second portion of the first side of the motherboard;
- and
- an EMI partition gateway for routing traces from the first portion of the first side of the motherboard to the second portion of the first side of the motherboard without causing significant EMI emissions.
1 more element
An assembly for a computer comprising:
- a substantially rectangular motherboard having a short edge and a long edge and having a first side and a second side, the first side having a first portion and a second portion, wherein a processor, a chipset component, and memory are connected to the first portion of the first side of the motherboard;
- a cover that encloses the first portion of the first side of the motherboard, but does not enclose the second portion of the first side of the motherboard, the cover extending along the entire length of the short edge, but only along part of the length of the long edge, the cover comprising:
- a top and two sides, the two sides oriented substantially perpendicular to the long edge of the motherboard with one of those sides sealed to the motherboard by an EMI seal, the cover open at first and second ends, the first and second ends oriented substantially parallel to the long edge of the motherboard;
- EMI waveguides positioned at the first end and the second end of the cover;
- and
- an EMI partition gateway for routing traces from the first portion of the first side of the motherboard to the second portion of the first side of the motherboard without causing significant EMI emissions, the EMI partition gateway comprising EMI stitch pads located adjacent to the traces and located on both the first side and the second side of the motherboard, the stitch pads on the first side staggered with respect to the stitch pads on the second side.
3 more elements
An assembly for a computer comprising:
- a substantially rectangular motherboard having a short edge and a long edge and having a first side and a second side, the first side having a first portion and a second portion, wherein a processor, a chipset component, and memory are connected to the first portion of the first side of the motherboard;
- a cover that encloses the first portion of the first side of the motherboard, but does not enclose the second portion of the first side of the motherboard, the cover extending along the entire length of the short edge, but only along part of the length of the long edge, the cover comprising:
- a top and two sides, the two sides oriented substantially perpendicular to the long edge of the motherboard with one of those sides sealed to the motherboard by an EMI seal, and the top having a movable section that lies above the memory that can be opened to enable access to the memory, wherein the cover is open at first and second ends, the first and second ends oriented substantially parallel to the long edge of the motherboard;
- a fan positioned at the first end of the cover;
- an AGP slot and at least one PCI slot located on the second portion of the first side of the motherboard;
- at least one connector for connecting peripheral devices to the assembly, the at least one connector located at the first end of the cover and located beneath the fan;
- EMI waveguides positioned at the first end and the second end of the cover;
- and
- an EMI partition gateway for routing traces from the first portion of the first side of the motherboard to the second portion of the first side of the motherboard without causing significant EMI emissions, the EMI partition gateway comprising EMI stitch pads located adjacent to the traces, the stitch pads being located on both the first side and the second side of the motherboard, the stitch pads on the first side staggered with respect to the stitch pads on the second side.
6 more elements
Dependencies are inferred from the claim text.