Electronic part and manufacturing method therefor

A method of manufacturing an electronic part in which a chip device having bump electrodes is sealed in an inner cavity of a resin container, said method comprising:

• bump-mounting said chip device on a conductor pattern of a mounting board which is made of a resin member, the conductor pattern being provided on at least either surface of the mounting board;
• overlaying an intermediate board on said mounting board interposing a first adhesive layer between the mounting board and the intermediate board, the intermediate board comprising a frame shape resin member having a window, the chip device being positioned in the window;
• overlaying a cover board constituted by a resin member for covering said window on said intermediate board such that a second adhesive layer is interposed between the intermediate board and the cover board;
• and
• applying pressure and heat to said mounting board, said cover board and said intermediate board interposed therebetween from outside in a direction of a thickness of each of said mounting board and said cover board to connect the mounting board, said intermediate board and said cover board with one another at one time so as to seal and form the inner cavity defined by an inner wall of said window, the pressure being applied in such a way so as to not pressurize a region in which the window has been provided.