Power semiconductor module
AssigneeABB Schweiz AG
InventorsThomas Lang, Benno Bucher, Toni Frey
Life of this patent
Estimating the term…
Abstract
A power semiconductor module in which at least one semiconductor chip with which contact is made by pressure is electrically connected via a contact element to a main connection. The contact element has two planar contact surfaces, between which a spring element is located. Irrespective of the individual position and height of a chip, the respective spring element ensures a standard contact force. Overloading of the semiconductor chips when the module is being clamped in is prevented by ceramic supporting elements.
Claims20
A power semiconductor module having an electrically conductive base plate, an electrically conductive cover plate and at least one semiconductor chip which is electrically connected by means of a first main electrode to the base plate and which is electrically connected by means of a second main electrode and via a sprung electrical contact element to the cover plate, characterized in that there is at least one spring element which spreads the at least one contact element into a shape which produces the electrical connection between the second main electrode and the cover plate.
The power semiconductor module as claimed in claim A, characterized in that, in order to prestress the spring element, means are provided which comprise a stamp having a stamp foot arranged between the spring element and the semiconductor chip, a stamp neck and a stamp head which is held in a stamp head chamber.
Dependencies are inferred from the claim text.