Semiconductor device comprising a socket and method for forming same
AssigneeMicron Technology, Inc.
InventorsLarry Kinsman, Salman Akram
Life of this patent
Estimating the term…
Abstract
An electronic device such as a semiconductor module comprises a printed circuit board and a socket attached to the printed circuit board and in electrical communication therewith. The socket comprises a plurality of electrically-conductive surfaces. The device further comprises a plurality of die and a plurality of supports each attached to the socket. At least one die is mechanically connected with each support, and each die has a plurality of electrically-conductive pads thereon. The plurality of electrically-conductive pads contact the electrically-conductive surfaces of the socket. A method for forming the electronic device is also described.
Claims22
A semiconductor device comprising:
- at least one semiconductor wafer section having a plurality of electrically-conductive pads;
- at least one support which receives said wafer section and contacts at least three sides of said wafer section;
- and
- a socket for receiving said semiconductor wafer section and said support, said socket having a plurality of electrically-conductive elements which are urged against and contact said electrically-conductive pads to provide a signal path from said wafer section.
An electronic device comprising:
- a printed circuit board;
- a socket attached to, and in electrical communication with, said printed circuit board, said socket comprising a plurality of electrically-conductive surfaces;
- a plurality of supports each received by said socket;
- and
- a plurality of semiconductor die wherein at least one said die is mechanically connected with each said support, each said die having a plurality of electrically-conductive pads thereon, wherein said plurality of electrically-conductive pads contact said electrically-conductive surfaces of said socket.
A semiconductor device comprising:
- a socket having a plurality of slots therein;
- a plurality of semiconductor wafer sections, wherein each said wafer section is received by one of said slots;
- and
- a plurality of wafer section supports each comprising a shelf, wherein each said wafer section is attached to one of said supports and each said shelf contacts an edge of said wafer section received by said support,
- wherein each said support is received by one of said slots.
A semiconductor device comprising:
- at least one semiconductor wafer section having a circuit side with a plurality of electrically-conductive pads and a back side opposite said circuit side;
- at least one support attached to said back side of said wafer section;
- and
- a socket adapted to receive both said semiconductor wafer section and said support attached to said wafer section, said socket having a plurality of electrically-conductive elements which are urged against and contact said electrically-conductive pads to provide a signal path from said wafer section.
Dependencies are inferred from the claim text.