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US 6,320,246 B1Granted
Semiconductor wafer assemblies
AssigneeMicron Technology, Inc.
InventorTerry Gilton
Life of this patent
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Abstract
The invention includes a semiconductor wafer assembly, comprising: a) a semiconductor wafer substrate; and b) alternating first and second layers over the semiconductor wafer substrate, the alternating layers comprising at least one first layer and at least one second layer, the first layer comprising a first material and the second layer comprising a second material, the second material comprising atoms selected from the group consisting of yttrium, lanthanides, actinides, calcium, magnesium and mixtures thereof.
Claims22
A semiconductor wafer assembly, comprising:
- a material, the material comprising three elevationally separated regions, one of the elevationally separated regions being a center region which is elevationally between the other two of the elevationally separated regions;
- each of the three elevationally separated regions comprising BPSG;
- detectable atoms within the material, the detectable atoms being at a greater concentration within said other two of the elevationally separated regions than within the center region;
- the detectable atoms being selected from the group consisting of yttrium, lanthanides, actinides, calcium, magnesium and mixtures thereof;
- the material of said other two of the elevationally separated regions consisting essentially of BPSG and the detectable atoms.
2 more elements
A semiconductor wafer assembly, comprising:
- a semiconductor wafer substrate;
- and
- alternating first and second layers over the semiconductor wafer substrate, the alternating layers comprising at least one first layer and at least one second layer, the at least one first layer comprising a first material and the at least one second layer comprising a second material, the second material comprising BPSG and detectable atoms selected from the group consisting of yttrium, lanthanides, actinides, calcium, magnesium and mixtures thereof;
- the first material comprising BPSG and being different than the second material.
1 more element
Dependencies are inferred from the claim text.