Non-volatile semiconductor memory device and manufacturing method thereof
AssigneeSeiko Epson Corporation
InventorTomoyuki Furuhata
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Abstract
The method of manufacturing a non-volatile semiconductor memory device comprises a step of providing a first ion implantation on the principal surface of a silicon substrate in a manner to cover a groove to form a first impurity region on the principal surface. Next, a step of providing a second ion implantation to cover the groove to form a second impurity region on the principal surface that overlaps the first impurity region at the groove and electrically connects the second source/drain region and the third source/drain region by the first impurity region. In short, the impurity region at the groove is formed by a twice ion implantation of the first and second ion implantations.
Claims21
A non-volatile semiconductor memory device storing information by an accumulation of electric charge, comprising:
- a semiconductor substrate having a principal surface comprising a first region and a second region;
- at least one memory element including:
- a floating gate formed in the first region;
- a control gate formed on the floating gate;
- a first source/drain region formed in the first region;
- and a second source/drain region formed in the first region apart from the first source/drain region, located by the floating gate and the control gate therebetween;
- at least one access gate transistor for selectively activating the memory element, the access gate transistor comprising:
- a gate electrode formed in the second region;
- a third source/drain region formed in the second region;
- and a fourth source/drain region formed in the second region apart from the third source/drain region, located by the gate electrode therebetween,
- wherein a groove section is unavoidably formed in the semiconductor substrate between the floating gate and the gate electrode, and
- wherein the non-volatile semiconductor memory device further comprises an impurity region formed in the semiconductor substrate so as to cover the groove section, the impurity region electrically connecting the second source/drain region and the third source/drain region, and having a higher impurity concentration than the first and the fourth source/drain regions.
Dependencies are inferred from the claim text.