Method of manufacturing a semiconductor device using a minute resist pattern, and a semiconductor device manufactured thereby

A method of manufacturing a semiconductor device comprising the steps of:

• forming a first resist pattern capable of supplying an acid on a semiconductor substrate by growing a first resist and by forming a pattern on the first resist;
• forming a second resist on the first resist pattern, the second resist being incapable of dissolving the first resist pattern and being capable of causing a crosslinking reaction in the presence of an acid;
• forming a crosslinked portion along the boundary surface between the first resist pattern and the second resist adjoining the first resist pattern by means of the acid supplied from the first resist pattern;
• forming a second resist pattern through multi-step processing, in which non-crosslinked portions of the second resist are developed through use of a solution in which the non-crosslinked portions have a high solubility in the solution and the solution is incapable of dissolving the first resist pattern, but capable of dissolving the second resist and then rinsing the substrate to prevent undissolved residues;
• and
• etching the semiconductor substrate, using the second resist pattern as a mask.