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US 6,319,756 B2Granted
Heat sink for chip stacking applications
AssigneeMicron Technology, Inc.
InventorsKevin G. Duesman, L. Jan Bissey
Life of this patent
Estimating the term…
Abstract
A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.
Claims25
A method of removing heat from stacked integrated circuits, said method comprising:
- providing at least one heat absorbing section;
- said heat absorbing section having at least one planar extending element interposed between stacked integrated circuits;
- providing a heat dissipation section;
- and,
- providing a heat transfer section interconnecting said heat absorbing section and said heat dissipating section, said heat transfer section having at least one heat transfer element connected to a respective planar extending element.
2 more elements
A method for removing heat from a stacked integrated circuit, said method comprising:
- providing a heat sink having a first portion configured to be interposed between two stacked integrated circuits and a second portion connected to said first portion for dissipating heat.
Dependencies are inferred from the claim text.