Method of manufacturing semiconductor device, semiconductor equipment and manufacturing system
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorHiroji Ozaki
Life of this patent
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Abstract
A manufacturing system compares information of foreign matter sensed by semiconductor equipment from on a semiconductor substrate with a selection reference thereby selecting optimum semiconductor equipment corresponding to the information of the foreign matter from a plurality of semiconductor equipment and processing the semiconductor substrate. Thus, a method of manufacturing a semiconductor device capable of improving the yield of the semiconductor device as well as a manufacturing system and semiconductor equipment to which the manufacturing method is applied, and a semiconductor device manufactured by the same are obtained.
Claims16
A method of manufacturing at least one semiconductor device from a semiconductor substrate with a plurality of semiconductor equipment, comprising the steps of:
- comparing information sensed from said semiconductor substrate by at least one semiconductor equipment with a selection reference;
- selecting another semiconductor equipment to change the information sensed by the at least one semiconductor equipment when the sensed information exceeds the selection reference;
- processing the semiconductor substrate so as to change the information on the semiconductor substrate with said another semiconductor equipment;
- sensing information from said semiconductor substrate with said another semiconductor equipment after the processing step changes the information;
- and
- updating said selection reference based on the information sensed with said another semiconductor equipment.
A manufacturing system for manufacturing at least one semiconductor device from a semiconductor substrate, comprising:
- a plurality of semiconductor equipment;
- and
- a control unit configured to control the plurality of semiconductor equipment and configured to compare information sensed from said semiconductor substrate by at least one semiconductor equipment with a selection reference stored in a database,
- wherein the control unit selects another semiconductor equipment to change the information sensed by the at least one semiconductor equipment when the sensed information exceeds the selection reference,
- wherein the another semiconductor equipment process the semiconductor substrate so as to change the information on the semiconductor substrate,
- wherein the another semiconductor equipment senses information on said semiconductor substrate after the information is changed, and
- wherein the control unit updates the selection reference based on the information sensed with said another semiconductor equipment.
A method of manufacturing at least one semiconductor device from a semiconductor substrate with a plurality of semiconductor equipment, comprising the steps of:
- comparing information sensed from said semiconductor substrate by at least one semiconductor equipment with a selection reference;
- selecting another semiconductor equipment to change the information sensed by the at least one semiconductor equipment when the sensed information exceeds the selection reference;
- processing the semiconductor substrate so as to change the information on the semiconductor substrate with said another semiconductor equipment;
- testing said semiconductor device after the processing step changes the information;
- and
- updating said selection reference based on a test result obtained through said testing step.
A manufacturing system for manufacturing at least one semiconductor device from a semiconductor substrate, comprising:
- a plurality of semiconductor equipment;
- and
- a control unit configured to control the plurality of semiconductor equipment and configured to compare information sensed from said semiconductor substrate by at least one semiconductor equipment with a selection reference stored in a database,
- wherein the control unit selects another semiconductor equipment to change the information sensed by the at least one semiconductor equipment when the sensed information exceeds the selection reference,
- wherein the another semiconductor equipment processes the semiconductor substrate so as to change the information on the semiconductor substrate,
- wherein the another semiconductor equipment tests the semiconductor device after the information is changed, and
- wherein the control unit updates said selection reference based on a test result obtained through the test.
Dependencies are inferred from the claim text.