Loading patent…
AssigneeNEC Corporation
InventorYasumasa Inomoto
Estimating the term…
A method of forming markers in manufacture with excellent productivity of a semiconductor device capable or forming the markers accurately aligned with the crystal direction in the same position of a semiconductor crystal substrate is provided. There is a marker forming method of forming a stepper marker pattern part (202) on the main surface of a semiconductor crystal substrate (101), and a mask (201) for exposure is overlaid on the position where segment-shaped patterns (205) formed on the main surface of the mask (201) for exposure match with a cleavage orientation flat (102) of the semiconductor crystal substrate (101), and the stepper marker pattern part is transferred by contact exposure. Because of this, the stepper marker pattern part (202) can be formed in the same position within the semiconductor crystal substrate (101). As a result of this, by using a stepper aligner with an automatic alignment function, operating efficiency of an exposure process improves and high productivity can be obtained.
A method of manufacturing a semiconductor device including a step of transferring a pattern formed in a mask for exposure on a semiconductor crystal substrate, comprising the steps of:
In an alignment method performed when transferring a pattern formed in a mask for exposure on a semiconductor crystal substrate, the alignment method in manufacture of a semiconductor device, comprising the steps of:
A mask for exposure for transferring a pattern on a semiconductor crystal substrate, the mask having plural segment-shaped patterns which are a chord joining two points on a circular arc matching with an outer peripheral circle of the semiconductor crystal substrate and are parallel one another.
Dependencies are inferred from the claim text.