Method of manufacturing member for thin-film formation apparatus and the member for the apparatus

A method of manufacturing thin-film formation apparatus having surfaces on which unnecessary thin films are deposited during sputtering, comprising the steps of:

• subjecting at least a portion of said surfaces to masking;
• subjecting said portion of said surfaces to etching processing after masking said surfaces;
• and
• removing said masking after said etching processing in order to provide said surfaces with unevenness;
• wherein, after said etching processing, said portion of said surfaces which have been subjected to etching processing has a center line surface roughness (Ra) in a range of about 5 to about less than 100 μm;
• and
• wherein said etching processing forms a plurality of concave and convex parts on said portion of said surfaces, and wherein one of said concave and convex parts is formed about 1 to about 100,000 per unit area (1 mm2) on said portion of said surfaces which has been subjected to etching processing.

A method of manufacturing thin-film formation apparatus having surfaces on which unnecessary thin films are deposited during sputtering, comprising the steps of:

• subjecting at least a portion of said surfaces to masking;
• subjecting said portion of said surfaces to etching processing after masking said surfaces;
• and
• removing said masking after said etching processing in order to provide said surfaces with unevenness;
• wherein, after said etching processing, said portion of said surfaces which have been subjected to etching processing has a center line surface roughness (Ra) in a range of about 5 to about less than 100 μm;
• and
• wherein said etching processing forms a plurality of concave and convex parts on said portion of said surfaces;
• wherein each of said concave parts is a recess formed in said surface, said recesses having an average diameter;
• wherein each of said convex parts is located adjacent to at least one concave part and has a top surface, said top surfaces having an average diameter;
• and wherein one of said average diameter of said recesses and said average diameter of said top surfaces is about 3 to about 1000 μm.