US 6,319,371 B2Granted

Film forming apparatus

AssigneeSony Corporation

InventorsHiroichi Ishikawa, Masayasu Kakinuma

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Abstract

A film forming apparatus comprises a sputtering chamber, a cooling drum disposed at an central portion thereof for cooling a roll film in contact with the surface thereof, a roll chamber, an SiOx film forming chamber and a monitor room disposed to the periphery of the drum, a sputter cathode disposed to the SiOx film forming chamber, and a moisture pump such as a cryogenic panel disposed in the film forming chamber for effectively discharging the moisture by which the partial pressure of the moisture in the film forming chamber is kept roll, in which the light absorption of the SiOx film after formation is monitored by an InSitu transmission light monitor, the value x for the SiOx is judged by the transmittance of light of the SiOx film to control the oxygen flow rate by an MFC such that the value x reaches an aimed value, thereby enabling to form an adhesion layer having sufficient adhesion and good permeability on the substrate.

Claims12

Dependent claims

A film forming apparatus, comprising:

(a) an oxygen supply,
(b) a controller,
(c) a first film forming chamber through which a substrate passes, the first film forming chamber housing a sputtering apparatus for sputtering a SiOx or a TiOx adhesion film on the substrate and a moisture discharging means, the first film forming chamber being connected to the oxygen supply, the oxygen supply being linked to the controller,
(d) a monitor chamber adjacent to the first film forming chamber comprising a means for measuring a transmittance of light through the adhesion layer formed on the substrate in the first film forming chamber, the means for measuring being connected to the controller for sending a signal indicative of the measured transmittance of light to the controller, the controller converting the signal indicative of the measured light transmittance into a value for “x”, wherein, when the value for “x” is below a predetermined acceptable lower limit, the controller increases the flow of oxygen by the oxygen supply to the first film forming chamber, and when the value for “x” is above a predetermined acceptable upper limit, the controller decreases the flow of oxygen by the oxygen supply to the first film forming chamber.

1 more element

Dependencies are inferred from the claim text.